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Job Description崗位說明： - develop, design and qualification of new products, technologies, equipment, material, processes and production lines 對新的產品，工藝，設備，物料，流程和生產線進行研發，設計和認證。 - define new product, process and equipment specifications 對新的產品，工藝流程以及設備規格進行定義。 - provide feasibility studies of new concepts and ideas 提供可行的新概念和構想進行研究。 - define and implement measurements to ensure product quality 定義和執行質量測量以確保產品的高質量。 - liaison with external suppliers (equipment, material or chemical suppliers) and internal relevant departments for technological development and process improvement 聯絡外部設備供應商（設備，物料或者藥水供應商）和內部相關部門合作以優化工藝和流程。 - take responsibility in new process qualification and new product implementation 負責新制程的認證和新產品的導入。 - ensure stable and robust process with full procedure compliance to manufacture high quality and reliable products 確保整個流程的穩定，以便生產出高品質，高保障的產品。 - actively participate or drive project for new process qualification, new product implementation 積極參與或者推動認證新制程和導入新產品的項目。 - continuously improve the process capability, quality, yield, productivity and resource optimization 持續提高制程能力,質量，良率，生產能力和資源***化能力。 - train the new employees and transfer know-how to other engineers to relevant departments and other plant 培訓新員工和傳授專業技能給其他相關部門和工廠的工程師。 - document know-how and keep updating quality related details so as to handover the well-established processes for mass production 修訂專業技能文件，并且持續更新與質量相關的細節，以便將這些建立好的工序交接給量產。 Requirement 崗位要求 - bachelor degree,major in engineering 本科學歷，工科專業 - knowledge of quality tools like spc, msa, doe, fmea, cp, etc 掌握質量工具spc, msa, doe, fmea, cp等知識 - good analytical skills with attention to details. 良好的細節分析能力 - process engineering experience in ic-substrate, hdi-pcb, assembly, ic-packaging or related industry 具備ic- substrate, hdi-pcb, assembly, ic-packaging或者相關行業工藝制程經驗 - fluent written and oral english (passed CET-4) 良好的英語聽書讀寫能力